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NVIDIA Tegra K1 TD570D - TD570D-A1 / TD570D-R-A1 information

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Type:SoC Manufacturer:NVIDIA
family:Tegra K1 microprocessors:NVIDIA Tegra K1 TD570D - TD570D-A1 / TD570D-R-A1
Type System-on-a-Chip
Market segment Mobile
Family
NVIDIA Tegra K1
Model number    TD570D
SoC part numbers
  • TD570D-A1 is a SoC in tray packaging
  • TD570D-R-A1 is a SoC in Tape & Reel packaging
Frequency    2000 MHz
Package 1216-ball Flip Chip-Chip Scale Package (S-FCCSP)
Socket BGA1216
Size 0.63" x 0.63" / 1.6cm x 1.6cm
Introduction date January 5, 2014 (announcement)
Architecture / Microarchitecture
Microarchitecture ARM7
Manufacturing process 0.028 micron
Data width 32 bit
The number of CPU cores 5 (4 high-performance cores + 1 low power core)
The number of threads 4
Floating Point Unit Integrated
Level 1 cache size    4 x 32 KB instruction caches (4-core cluster)
32 KB instruction cache (low power core)
4 x 32 KB data caches (4-core cluster)
32 KB data cache (low power core)
Level 2 cache size    Shared 2 MB 16-way set associative cache (4-core cluster)
512 KB 16-way set associative cache (low power core)
Level 3 cache size None
Physical memory 8 GB
Pipeline 15 stages
Features NEON technology
Low power features
  • Suspend state
  • Deep Sleep state   
  • Dynamic Voltage and Frequency Scaling
Integrated peripherals / components
Integrated graphics GPU Type: Kepler
CUDA cores: 192
Performance (GFLOPS): 250
Memory controller The number of controllers: 1
Memory channels: 1
Channel width (bits): 64
Supported memory: DDR3L-1600, LPDDR3-1600
Maximum memory bandwidth (GB/s): 14.9
Other peripherals
  • Audio-Video Processor (AVP)
  • 2 display controllers
  • ULP Audio
  • Advanced Imaging unit
  • HD Video Encoder / Decoder units
  • Security coprocessor (TSEC)
  • Security Engine
  • USB 2.0 / 3.0 controller
  • XHCI host controller
  • SD/eMMC controller
  • Flash controller
  • Camera controller
  • UART
  • Legacy I/O
Electrical / Thermal parameters
Minimum/Maximum operating temperature    -25°C - 105°C
Notes on NVIDIA Tegra K1 TD570D
  • The processor is built on 4-PLUS-1 design, which combines 4 Cortex A15 cores with a single Cortex A15 low-power core
  • CPU frequency may be throttled down when operating at high temperatures (greater than 70°C)
  • The CPU is compatible with DirectX 11.1, OpenGL 4.4 and OpenGL ES3.0 APIs.


other microprocessors
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NXP Semiconductors LPC1112FHN33/201 NXP Semiconductors LPC1113FHN33/201
NXP Semiconductors LPC1113FHN33/301 NXP Semiconductors LPC1113FBD48/301
NXP Semiconductors LPC1114FHN33/201 NXP Semiconductors LPC1114FHN33/301
NXP Semiconductors LPC1114FBD48/301 NXP Semiconductors LPC1114FA44/301

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